Product

ZEISS Crossbeam

FIB-SEM for High Throughput 3D Analysis and Sample Preparation

Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). You may be working in a multi-user facility, as an academic or in an industrial lab. Take advantage of ZEISS Crossbeam’s modular platform concept and upgrade your system with growing needs, e.g. with the LaserFIB for massive material ablation. During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.

Maximize your SEM insights
Increase your FIB sample throughput
Experience best 3D resolution in your FIB-SEM analysis

Investigate the Crystal Structure of NanoSQUIDS

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Learn in this video how the TEM lamella preparation workflow of Crossbeam enables Benedikt Müller, University of Tuebingen, and Claus Burkhardt, NMI Reutlingen, to investigate the crystal structure of NanoSQUIDS with Josephson junctions fabricated by ion beam nano lithography in cooperation with Prof. R. Kleiner & Prof. D. Koelle, Eberhard Karls University of Tuebingen, Germany.

Maximize Your SEM Insights

Extract true sample information from your high resolution SEM images using Gemini electron optics.
Count on the SEM performance of your Crossbeam for 2D surface sensitive images or when performing 3D tomography.
Benefit from high resolution, contrast and signal-to-noise ratios, even when using very low accelerating voltages.
Characterize your sample comprehensively with a range of detectors. Get pure materials contrast with the unique Inlens EsB detector.
Investigate non-conductive specimens undisturbed by charging artifacts.

Increase Your FIB Sample Throughput

Profit from speed and precision of intelligent FIB scanning strategies for material removal and perform your experiments up to 40% faster than before.
The Ion-sculptor FIB column introduces a new way of FIB-processing: by minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time.
Manipulate your samples precisely and fast by using up to 100 nA current without compromising FIB resolution.
When preparing TEM samples use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum.

_{The focused ion beam column, ZEISS Ion-sculptor, of Crossbeam.}

3D tomography of a solder, this image is part of a multi-modal workflow combining imaging and EDS analytics. (Image width 38 µm). — 3D tomography of a solder, this image is part of a multi-modal workflow combining imaging and EDS analytics. (Image width 38 µm)

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D analysis for EDS and EBSD investigations.
During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.
Expand the capacity of your Crossbeam with ZEISS Atlas 5, the market-leading package for fast, precise tomography.
Perform EDS and EBSD analysis during tomography runs with the integrated 3D Analytics module of Atlas 5.
Profit from best 3D resolution and leading isotropic voxel size in FIB-SEM tomography. Probe less than 3 nm in depth and produce surface sensitive, material contrast images using the Inlens EsB detector.
Save time by collecting your serial section images while milling. Take advantage of trackable voxel sizes and automated routines for active control of image quality.

Crossbeam Family

Exploit low vacuum operation and perform in situ experiments with outgassing or charging samples with the Variable Pressure mode. Achieve high quality imaging and high throughput thanks to the unique Gemini electron optics and the Ion-sculptor FIB.

Prepare and characterize your most demanding samples, choosing the chamber size that best suits your samples. The Gemini 2 electron optics enables high resolution, even at low voltage and high current. It’s ideal for high resolution imaging at high beam current and for fast analytics.

Your tool for fully automated, high-volume TEM sample preparation. Optimized for robust, unsupervised multi-site lamella preparation, it is a pre-configured high-end Crossbeam that will maximize your lab’s TEM lamella productivity. The excellent low-kV performance of the Ion-sculptor FIB column ensures exceptional lamella quality. Uncompromised SEM live imaging while milling enables highly accurate endpointing and thickness control even on the smallest semiconductor devices.

Your instrument for massive material ablation and preparation of large samples - the femtosecond laser on the airlock enhances in situ studies, avoids chamber contamination and is configurable with Crossbeam 350 and 550. Gain rapid access to deeply buried structures or prepare extremely large or high-aspect ratio structures e.g. atom probes.

This solution for TEM lamella preparation and volume imaging under cryogenic conditions enables imaging near-to-native state. Connect widefield, laser scanning, and focused ion beam scanning electron microscopy. Keep the flexibility of a multi-purpose FIB-SEM simultaneously.

Discover Workflows on Crossbeam

Explore TEM Lamella Preparation, Correlated Cryo, and Laser Workflows

Array of TEM lamella fabricated with automated preparation, width of one lamella ca. 20 µm. Crossbeam 550.

Conventional TEM Sample Preparation

TEM lamella preparation is essential for almost any FIB-SEM user. ZEISS offers guided workflow for site-specific preparation. The resulting lamellae are ideally suited for high resolution TEM and STEM imaging and analysis at atomic resolution. Navigate to the specimen’s ROI, extract your TEM lamella including ROI from your bulk sample, perform the bulk milling or trenching step, and finalize the workflow with lift-out and thinning where appropriate.

Conventional TEM Sample Preparation
1. Navigation to the Specimen’s Regions of Interest (ROI)

● Begin your guided, semi-automated workflow by reducing sample navigation times
● Use the navigation camera on the airlock and its GUI being integrated into the SEM’s operational software to quickly find ROIs and store their position
● The design of the Gemini electron optics facilitates identification and precise access to even the smallest ROI by providing you with a large field of view without distortion even at high resolutions
Lamella chunk in a hard disk slider sample. Fabricated with ASP, including the undercut.

Conventional TEM Sample Preparation
2. Preparation of a Lamella from a Bulk Sample

● Define a chunking recipe with milling, deposition and position correction settings
● Place a lamella shape at the desired position and assign the recipe
● Take a reference image for the subsequent position corrections
● Repeat these three steps at any number of points on the sample
Lift-out of the lamella from the bulk.

Conventional TEM Sample Preparation
3. Lift Out

● Bring in the micromanipulator and attach the lamella to its tip
● Cut out the lamella from the bulk
● The lamella is then ready for lift out and can be transferred to a TEM grid
Thinning process monitoring, simultaneously for thickness (left) and endpoint (right).

Conventional TEM Sample Preparation
4. Thinning

● Thinning is the crucial step of the workflow as it defines the quality of your TEM lamella
● The instrument’s design allows you to reach the desired thickness of a lamella by enabling live monitoring of the thinning
● Use two detector signals in parallel. Judge the thickness with the SE detector and obtain a reproducible end thickness. Control surface quality and thinning to the endpoint with the Inlens SE detector

● Prepare high quality samples with negligible amorphization

Multiple lamella on TEM grid — Test case for fully-automated lamella preparation: the lamellae were cut, lifted out and transferred to a TEM grid without user intervention.

Advanced, Fully-automated TEM Lamella Preparation

Semiconductor labs can maximize their productivity for TEM lamella preparation by using a fully automated solution. Take advantage of the ZEISS Crossbeam 550 Samplefab, an optimally-configured high-end FIB-SEM, to experience:

Exceptional lamella quality achieved with the excellent low-kV performance of the Ion-sculptor FIB column
Highly accurate endpointing and thickness control on even the smallest semiconductor devices, enabled by uncompromised SEM live imaging while milling

Main steps of the automated TEM lamella preparation workflow performed by Crossbeam 550 Samplefab.

Advanced, Fully-automated TEM Lamella Preparation
1. Automated Workflow Steps

Perform automated TEM lamella preparation with ZEISS Crossbeam 550 Samplefab
All steps of TEM lamella preparation are fully supported: “chunking”, lift out from bulk and transfer to grid, and thinning

Execute the steps individually or linked as required to complete your automated workflow, which can then be queued for batch processing of multiple sites on one or more samples
High throughput lamella processing workbench with (a) Lamella set up and (b) multi-site processing panels.

Advanced, Fully-automated TEM Lamella Preparation
2. One Single User Interface

Use a single software interface for all TEM sample preparation user operations e.g., creation or editing of recipes, grid preparation, batch definition

With an intuitive, easy-to-use GUI, the software guides you seamlessly through the setup of single or multiple lamella runs
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Examples of automatically captured documentation images from a multi-site run of four lamellae.

Advanced, Fully-automated TEM Lamella Preparation
3. Hands-free Single or Batch Lamella Preparation

The fully-automated run requires no user intervention and captures comprehensive documentation automatically

The robust and safe workflow has a guaranteed interruption-free automation yield of better than 90%

Watch this animation and discover how the LaserFIB workflow helps you to optimize and automate laser processing.

Crossbeam laser Workflow

Rapidly access deeply buried regions of interest, execute correlated workflows across multiple length scales and acquire better sample representativity with large-volume analysis. Perform 3D imaging and analytics e.g. EDS or EBSD. Now, semi-automated devices enable you to save time and increase your throughput even more.

Add a femtosecond laser to your Crossbeam and benefit from site-specific, ultra-fast sample preparation. Keep your FIB-SEM chamber clean and operate the system remotely with a semi-automated workflow when needed.

Your benefits:

Gain rapid access to deeply buried structures
Benefit from minimal damage and heat affected zones due to femtosecond laser pulses in a controlled vacuum environment
Perform laser work in a dedicated integrated chamber to maintain cleanliness of your FIB-SEM main chamber and detectors
Automate laser processing, polishing, cleaning and transfer of the sample to the FIB chamber
Prepare multiple samples from cross-sections over TEM lamellae to pillar arrays, and work efficiently by using pre-installed recipes for different materials

A multi-chip package with copper microbumps and flip chip interconnect, laser-milled and FIB-polished cross-section, trench depth 1.6mm.

A multi-chip package with copper microbumps and flip chip interconnect, laser-milled and FIB-polished cross-section, trench depth 1.6mm.

Crossbeam laser Workflow
1. Rapid Access, Optimized Preparation and Multiple Scales

Reveal deeply buried structures orders of magnitude faster than PFIB (Plasma FIB)
Ensure minimal damage and heat affected zones due to femtosecond laser processing in a controlled environment
Maintain an air free workflow from laser processing to analysis in the FIB; select nitrogen or argon as your environment gas
Correlate your ROIs with previously acquired 3D XRM or other external datasets via a tailored workflow
Increase the speed of ablation and its performance using the new Burst Mode
LaserFIB, details, laser chamber and laser optics to the right, FIB-SEM chamber to the left.

LaserFIB, details, laser chamber and laser optics to the right, FIB-SEM chamber to the left.

Crossbeam laser Workflow
2. Workflow Automation

Automated shuttling and laser processing lets you save time and increase throughput when preparing multiple samples with your LaserFIB
Remotely operate the system and create unattended automated experiments using the laser, the motorized transfer rod and subsequentially the FIB-SEM
One click in the software now performs the registration procedure between laser and FIB-SEM
Scripting enables automated workflow creation and increases efficiency in your experiments
Use scripting further to combine different recipes or activate vacuum conditions (nitrogen or argon gas)
Three trenches laser-milled in copper, with cross-jet off (top) and on (bottom).

Three trenches laser-milled in copper, with cross-jet off (top) and on (bottom).

Crossbeam laser Workflow
3. Maintain Cleanliness, Ensure Throughput and Ease-Of-Use

Perform laser work in a dedicated integrated chamber to maintain cleanliness of your FIB-SEM main chamber and detectors
Benefit from the protective glass window and the cross-jet. The cross-jet, a gas flow of either nitrogen or argon, prevents ablated material to deposit on the protective glass underneath the laser optics and keeps it clean during laser processing.
The laser also helps to clean redeposited material around trenches especially during multi-site preparation
Array of 25 pillars in silicon, laser milled in about 30 seconds, using Burst Mode, ready for fine polishing with the Gallium FIB.

Array of 25 pillars in silicon, laser milled in about 30 seconds, using Burst Mode, ready for fine polishing with the Gallium FIB.

Crossbeam laser Workflow
4. Enter a New World of Sample Preparation

Combine the benefits of the fs laser and Ga FIB and prepare a multitude of samples from huge cross-sections, TEM lamellae and atom probe tomography samples to arrays of pillars for micro compression testing or synchrotron microscopy and nanoCT
Machine extremely large cross-sections up to millimeters in width and depth using the fs laser
Remove specific layers of material with the laser using precision depth milling
Find suitable parameters for efficient laser processing easily by using pre-installed recipes or define your workflows individually.

TEM Lamella Preparation and Volume Imaging under Cryogenic Conditions

Cryogenic microscopy allows the examination of cellular structures in their near-to-native state. However, users face complex challenges, such as preparation, devitrification, ice contamination, loss of samples or correlation across imaging modalities. ZEISS Correlative Cryo Workflow connects widefield, laser scanning, and focused ion beam scanning electron microscopy in a seamless and easy-to-use procedure. Hardware and software are optimized for the needs of correlative cryogenic workflows, from localization of fluorescent macromolecules to high-contrast volume imaging and on-grid lamella thinning for cryo electron tomography.

Correlated Cryo Lamella Workflow
Imaging the Near-To-Native State

● Seamless cryogenic workflow across multiple modalities
● Sample protection against devitrification and ice contamination
● High resolution fluorescence imaging
● High contrast volume imaging and 3D reconstruction
● Targeted on-grid lamella thinning for cryo TEM applications
● Multipurpose use for cryogenic and room temperature applications
A Simplified Workflow to Help You Focus On Your Research

With Correlative Cryo Workflow, you master the challenging combination of different imaging modalities under cryo conditions. The workflow solution connects light and electron microscopy, enabling volume imaging and efficient production of TEM lamellae. Dedicated accessories simplify the workflow and facilitate a safe transfer of cryo samples between the microscopes. Data management is assured by ZEISS ZEN Connect, which keeps your data in context throughout the workflow. A series of processing tools help you enhance the imaging results.
M. Pilhofer, ETH Zürich, Switzerland
Double-labelled yeast cells (CNM67-tdTomato and NUP-GFP).

LSM image (left) and Crossbeam image (right).

Double-labelled yeast cells (CNM67-tdTomato and NUP-GFP).

Superior Components to Give You Best-In-Class Data Quality

Thanks to cryo-compatible objectives and the high sensitivity of the Airyscan detector, ZEISS LSM systems enable you to detect proteins and cellular structures at high resolution while gentle illumination and constant low temperatures prevent your samples from devitrification. The Crossbeam FIB-SEM lets you enjoy high contrast volumetric imaging – even without heavy metal staining applied to your samples. Both modalities provide valuable functional and structural information that can give you a thorough understanding of ultrastructure, whether or not you follow up with TEM studies.
4. Thinning: The Final Step Is Crucial, as It Defines the Quality of Your TEM Lamella

Multipurpose Solutions to Maintain Your Imaging Facility’s Productivity

Unlike other solutions, the ZEISS microscopes involved in the workflow can be used not only for cryogenic microscopy, but also for room temperature applications, which is particularly advantageous when the microscopes are not being fully utilized for cryogenic experiments. Converting the instruments from cryogenic to room temperature usage is done quickly and doesn’t require technical expertise. This flexibility gives users more time for their experiments. Imaging facilities benefit from better utilization and a faster return on investment.

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of Crossbeams is based on Gemini 1 VP column electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 350 or the Gemini 2 column of Crossbeam 550.

Field emission SEMs are designed for high resolution imaging. Key to the performance of a field emission SEM is its electron optical column. Gemini technology comes with all ZEISS FE-SEMs and FIB-SEMs: it is tailored for excellent resolution on any sample, especially at low accelerating voltages, for complete and efficient detection, and ease-of-use.

Gemini Optics Is Characterized by Three Main Components

The Gemini objective lens design combines electrostatic and magnetic fields to maximize optical performance while reducing field influences at the sample to a minimum. This enables excellent imaging, even on challenging samples such as magnetic materials.
Gemini beam booster technology, an integrated beam deceleration, guarantees small probe sizes and high signal-to-noise ratios.
The Gemini Inlens detection concept ensures efficient signal detection by detecting secondary (SE) and backscattered (BSE) electrons in parallel minimizing time-to-image.

Benefits for Your FIB-SEM Applications

Long-term stability of the SEM alignment and the effortless way it adjusts all system parameters such as probe current and acceleration voltage
Achieve distortion-free, high resolution imaging even over large fields of view with the help of the near magnetic-field free optics
Tilt the specimen without influencing the electron optical performance
ZEISS Crossbeam 350: Gemini column with single condenser, two Inlens detectors and VP capability.

Crossbeam 350 with Gemini 1 VP

✔ Maximum sample flexibility in multi-purpose environments offering variable pressure (VP) as an option.
✔ Enabling in situ experiments with outgassing or charging samples.
✔ Unique Gemini material contrast with the Inlens EsB detector

ZEISS Crossbeam 550: Gemini II column with double condenser and two Inlens detectors.

Crossbeam 550 with Gemini 2

✔ High resolution even at low voltage and high current thanks to the double condenser system.
✔ More information in less time with high resolution imaging and fast analytics.
✔ Unique topographical and material contrast with simultaneous Inlens SE and EsB (energy selective backscatter) imaging
Profit from Surface Sensitive Imaging

Today’s SEM applications demand high resolution imaging at low landing energy as a standard. It is essential for:

beam sensitive samples
non-conductive materials
gaining true sample surface information without undesirable background signal from deeper sample layers

The novel Gemini optics are optimized for resolutions at low and very low voltages and for contrast enhancement; it is characterized by the included high gun resolution mode and the optional Tandem decel.

The high gun resolution mode improves image resolution by reducing the primary energy width by 30% thus minimizing the chromatic aberration.
Tandem decel optional sample biasing up to 5 kV further improves the excellent imaging capabilities at low voltages.

Tandem decel optional sample biasing up to 5 kV further improves the excellent imaging capabilities at low voltages.

Tandem decel - How it works

Tandem decel, a two-step deceleration mode, combines the beam booster technology with a high negative bias voltage that is applied to the sample: the electrons of the primary electron beam are decelerated; thus, the landing energy is effectively reduced. Tandem decel, offered for Crossbeam 350/550, can be used in two different modes. Either apply a variable negative bias voltage between 50 V and 100 V to enhance the contrast of your images or apply a negative bias voltage between 1 kV and 5 kV and improve the low kV resolution of your images.
ZEISS Crossbeam 550 with a Gemini II column incl. double condenser and two Inlens detectors and a FIB-column arranged at an inclination angle of 54°.

ZEISS Crossbeam 550 with a Gemini II column incl. double condenser and two Inlens detectors and a FIB-column arranged at an inclination angle of 54°.

Discover a New Way of FIB Processing

The Ion-sculptor FIB column speeds up your FIB work without compromising machining precision and lets you benefit of its low voltage performance for any sample.

The Crossbeam Family carries the next-generation focused ion beam column, Ion-sculptor, featuring high currents for high throughput and excellent low voltage performance for high sample quality.

Maximize sample quality by using the low voltage capabilities of the Ion-sculptor FIB column
Minimize amorphization of your specimens and get the best results after thinning
Get precise and reproducible results with maximum stability
Accelerate your FIB applications with fast probe current exchanges
Perform high throughput experiments thanks to beam currents of up to 100 nA
Achieve exceptional FIB resolution of less than 3 nm
The Crossbeam family comes with automatic FIB emission recovery for long-term experiment

Fresnel zone plate, example for nanopatterning.

Applications in Materials Science

Develop new materials, understand and tailor their physical and chemical properties. Explore applications examples from nanoscience, engineering and energy materials. See how Crossbeam helps you to prepare, image and analyze your samples in 2D and 3D.

^{Caption: Fresnel zone plate, example for nanopatterning.}

See more application examples

Engineering Materials

Batch preparation of an array of compression testing pillars in high entropy alloy, machined fully automatically with the fs laser of Crossbeam laser.

A FIB prepared cross section of a silver/nickel/copper layered system used for battery contacts, imaged in quad mode simultaneously with all detectors at 1 kV, clockwise from uppr left to lower right: Inlens SE, SE, Inlens EsB, mix of Inlens SE & SE Sample: courtesy of D. Willer, MPA Stuttgart, DE.

Work efficiently with pre-installed recipes for laser processing: rough trench in a copper sample. This large trench with dimensions in the mm regime is used for rough precutting with a very high rate of removal but low surface finish, fine cut and polishing will follow.
Acquired with Crossbeam laser.

Work efficiently with pre-installed recipes for laser processing: polishing trench in a steel sample. After machining a rough and then a fine trench finally optimized sidewall quality is achieved by polishing. It reveals the microstructure of metallic samples. Acquired with Crossbeam laser.

Energy Materials

A FIB-SEM 3D tomography combined with EDS analysis of an aged solid oxide electrolysis cell, lower edge length of the volume of interest 38 µm. Sample: courtesy of M. Cantoni, EPFL, Lausanne, CH.

Investigating trace concentrations of alkali elements known to improve solar cell efficiency. CIGS (copper indium gallium selenide) solar cells, left: false-colored SEM image of a cross-section (from top to bottom: ZnO:Al blue, ZnO grey, CdS yellow, CIGS purple, Mo green, glass substrate light grey, image width 2,12 µm); SIMS map (right).

Nanomaterials

Nanofluidics channels fabricated by FIB in a silicon master stamp, detail: meander- shaped channel (Image width 55 µm). Sample courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.

A sieve-style zone plate was nanofabricated using Crossbeam and Atlas 5 NPVE Advanced. Atlas 5 acquired it as a single 32k × 24k pixel image.

Sample in silicon prepared with Crossbeam laser.
A specific site was marked by an ion beam induced deposition and prepared. First, a pillar is isolated from the bulk by laser machining. Next, the sample is shaped by FIB milling.

FIB-SEM tomography dataset acquired from a commercially purchased 3D NAND sample.

Applications in Electronics & Semiconductor

Discover Crossbeam applications in the field of electronics and semiconductor manufacturing.

See more application examples

3D NAND – FIB-SEM Tomography

FIB-SEM tomography dataset of a commercially purchased 3D NAND sample acquired using Crossbeam 550 and the 3 D Tomography module of Atlas 5. Sample was depackaged and mechanically polished down to the topmost word line. Shown is a virtual sub-volume of 2 x 1.5 x 0.7 µm³ size, extracted from the dataset at the transition region of upper to lower deck. Reconstructed voxel size 4 x 4 x 4 nm³.

Insulated Gate Bipolar Transistor (IGBT) device analysis performed entirely on a Crossbeam 550

Power Electronics – Insulated Gate Bipolar Transistor Device Analysis

Insulated Gate Bipolar Transistor (IGBT) device analysis performed entirely on a Crossbeam 550. Brightfield 30 kV STEM-in-SEM image of lamella combined with EDX elemental mapping in Crossbeam revealed crystalline Si precipitates.

Left: 3D IC prepared using laser ablation and FIB polishing. Right: Backscattered electron image of microbump.

3D Stacked Die Interconnect Analysis

Crossbeam laser provides fast, high-quality cross sections of 25 µm diameter Cu-pillar microbumps and BEOL structures buried 860 µm deep in a 3D integrated circuit (IC) package with total time to results of <1 hour. Left: 3D IC prepared using laser ablation and FIB polishing. Right: Backscattered electron image of microbump.

3D atomic level analysis by atom probe tomography is enabled by the fs laser of Crossbeam for rapid moat preparation as well as endpointing by live SEM imaging while ion milling at low kV during final tip sharpening.

Atom Probe Sample Preparation

3D atomic level analysis by atom probe tomography is enabled by the fs laser of Crossbeam for rapid moat preparation as well as endpointing by live SEM imaging while ion milling at low kV during final tip sharpening.

3D volume of C.elegans consisting of 10.080 z-sections at 5 x 5 x 8 nm pixel size

Applications in Life Sciences

Discover Crossbeam applications in various areas of life science research.

See more application examples

Cell Biology – HeLa Cells

Investigation of different cell compartments in single cells. Individual HeLa cells were grown in culture dishes, chemically fixed and resin-embedded in EPON. Voxel size 5 × 5 × 8 nm, Inlens EsB detection, 1400 sections. 3D visualization with Dragonfly Pro, ORS. Courtesy: A. Steyer and Y. Schwab, EMBL, Heidelberg, DE.

Neuroscience – Brain Sections

Large area milling and imaging of a brain section with the 3D Tomography module of Atlas 5. High current allows fast milling and imaging of large fields of view up to 150 μm in width. The depicted area of the brain has a field of view of 75 μm in width and was milled with a beam current of 20 nA. Courtesy: C. Genoud, FMI Basel, CH.

Developmental Biology – C. elegans

Atlas 5 enables the understanding of the morphology of a whole organism in 3D with the highest resolution and reliability. The data set shows a large 3D volume of C.elegans consisting of 10.080 z-sections at 5 x 5 x 8 nm pixel size. The nematode was high pressure frozen and freeze-substituted in EPON. Even the smallest structures inside the worm can be identified very easily. Courtesy: A. Steyer and Y. Schwab, EMBL Heidelberg, DE; and S. Markert and C. Stigloher, University of Wuerzburg, DE.

Accessories

Visualization and Analysis Software: ZEISS Recommends Dragonfly Pro

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, and SEM. Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.

Introducing ToF-SIMS Enables High Throughput in 3D Analysis

Add the ToF-SIMS (time of flight secondary ion mass spectrometry) spectrometer to your Crossbeam 350 or Crossbeam 550 and analyze trace elements, light elements (e.g. lithium), and isotopes. Profit from sensitive and comprehensive analyses in 3D. Perform elemental mapping and depth profiling. Benefit from parallel detection of atomic and molecular ions down to the ppm level, achieve resolutions better than 35 nm in lateral direction and 20 nm in depth. Retrieve any signal from the ROI post-mortem.

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