ZEISS Crossbeam 550 Samplefab microscope with monitor on right side in white surrounding

Product Introduction

ZEISS Crossbeam 550 Samplefab FIB-SEM

28 October 2024 10 min read

Explore the Advanced Features of

Crossbeam 550 Samplefab

As a semiconductor industry professional, you understand that high-quality TEM imaging depends on producing accurate, repeatable, and high-throughput lamellae.

However, achieving this can be a time-consuming and challenging process.

The new ZEISS Crossbeam 550 Samplefab offers an automated solution to produce multiple TEM lamellae and requires only minimal operator setup and supervision.

With our solution, you can streamline your TEM sample preparation and dramatically improve the efficiency of your semiconductor lab.

User-Friendly Interface for Easy Operation

Crossbeam 550 Samplefab user interface has been completely redesigned to facilitate rapid learning and intuitive operation for both novices and expert users, ensuring a seamless experience. The enhanced control software improves stability and usability, further streamlining the operational process.
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Automated TEM Sample Preparation for Optimized Results

Crossbeam 550 Samplefab microscope’s hands-free TEM lamella preparation process can create 10 lamellae in under 8 hours, saving valuable time and resources. Its proprietary lift-out technology provides superior automation yield and the ability to thin down to 100 nm on a variety of semiconductor sample types, ensuring high-quality results every time.
Superior Automation Yield for Maximum Success Rates

Recipe-based automation promises an automation yield of >90% for unsupervised processing of lamellae from bulk sample to TEM grid, without operator intervention. Automated checks allow human interventions to ensure no lamella are lost during processing, driving lamella success rates towards 100%.
Stable and Efficient Workflow for Increased Productivity

The Crossbeam Samplefab workflow is so robust that dozens of lamellae can be created using a single probe tip, which only needs reshaping after multiple days of heavy use. This significantly enhances the tool's productive uptime and reduces expenses on consumables, ultimately saving you both time and money.

To address the growing industry need for TEM sample preparation, we have built a dedicated FIB-SEM, the Crossbeam 550 Samplefab. Our focus is to offer the most robust automation available on the market today, allowing fully unsupervised operation of down to 100 nm thin lamellae with high accuracy and throughput.

Dr. Thomas Rodgers
Head of business sector electronics at ZEISS Microscopy