ZEISS Versa X-ray Microscopes
Discover More with 3D X-ray Imaging at Submicron Resolution
Experience the power of ZEISS Versa X-ray microscopes, the proven choice for researchers and scientists worldwide. Versa XRM feature intuitive user interfaces, ensuring that every user can maximize their productivity and achieve exceptional results. Prioritizing real resolution in practical settings, Versa XRM provide you with the capability to observe even the smallest details with unparalleled clarity. Renowned for their stability and precision, the ZEISS commitment to quality is evident in every aspect of Versa XRM. Trust that your investment will withstand the test of time, meeting your needs for years to come.
VersaXRM 730
ZEISS VersaXRM™ 730 offers submicron imaging with 450-500 nm resolution across 30-160 kV with the exclusive 40x-Prime objective. Its ZEN navx™ automated user guidance and control system and AI-driven DeepRecon Pro streamline workflows, optimize image quality, and speed throughput. Designed for accessibility, it supports a broad user spectrum, enabling advanced research capabilities with ease for your whole team.
Mouse models are valuable tools in genetic research since they closely resemble humans in terms of physiology and genetics. Non-destructive XRM is an ideal imaging technology for such a sample. This iodine-contrasted E15.5 mouse embryo was imaged using FAST Mode on VersaXRM 730 with a total scanning time of 6 minutes. Sample courtesy of Chih-Wei Logan Hsu, Baylor College of Medicine.
VersaXRM 615
Unlock new degrees of versatility for your scientific and industrial research with ZEISS VersaXRM 615. This cost-effective solution for a high-end X-ray microscope delivers advanced resolution and contrast, pushing non-destructive imaging further for accelerated research. With innovative source and optics technology, enjoy rapid tomography scans that maintain quality. Seamless workflows facilitate the discovery of high resolution interest areas without sample alteration.
Smart watch battery. ZEISS VersaXRM 615 scans the intact battery to identify areas of interest and zoom-in for high resolution imaging.
Xradia 515 Versa
Experience exceptional versatility in your scientific and industrial research with ZEISS Xradia 515 Versa, a trusted X-ray microscope for modern labs. Its hallmark Resolution at a Distance (RaaD) capability ensures class-leading resolution over longer working distances, fostering groundbreaking insights for a wide variety of sample types. Paired with powerful contrast and 4D/in situ capabilities for a variety of research needs, this flexible platform ensures a fast time to results.
Copper sulfide ore imaged with Versa, using Mineralogic 3D for classification of mineralogy
Perfect Tomographies. Every user. Every sample. Every time.
A quick view of the capabilities of ZEISS VersaXRM 730.
The Technology Behind ZEISS Versa X-ray Microscopes
-
The Versatile Advantage of RaaD
The two-stage magnification technique offered by ZEISS Xradia Versa uniquely achieves Resolution at a Distance, or RaaD, which enables you to effectively study the widest range of sample sizes, including those within in situ chambers.
Images are initially magnified via geometric projection as with conventional microCT. The projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.
Reducing dependence on geometric magnification enables ZEISS Xradia Versa solutions to maintain submicron spatial resolution down to 500 nm at large working distances.
-
One-Minute Tomographies with Fast Acquistion Scanning Technology
FAST Mode, enabled by Your Flat Panel Extension (FPX)
FAST Mode on ZEISS VersaXRM enables rapid 3D image acquisition for all samples through continuous motion scanning. Used with the optional flat panel detector (FPX), this mode allows non-stop sample rotation during X-ray image capture at various angles, eliminating the overhead delay of traditional step-and-shoot acquisition. Thus, dramatically faster scan times can be attained when exposure times are below 0.5 seconds, typical for the large, sensitive FPX detector. Expect acquisition times generally from <1 to 5 minutes, and even below 20 seconds for less stringent image quality needs.
FAST Mode enables true, nearly real-time 3D navigation for all samples thanks to full integration with the Volume Scout workflow in ZEN navx. FAST Mode acquisition integrates seamlessly with Volume Scout to allow for nearly immediate feedback and true 3D navigation to the correct region of interest in your complex samples.
-
Push the Limits of Scientific Advancement
ZEISS Versa X-ray microscopes provide the industry's premier 3D imaging solution for the widest variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.
These studies require samples to be further away from the X-ray source to accommodate various types of in situ rigs. On traditional microCT systems, this significantly limits the resolution achievable for your samples. ZEISS Versa XRM are uniquely equipped with dual-stage magnification architecture with RaaD technology that enable the highest resolution for in situ imaging.
ZEISS Versa XRM platforms can accommodate a variety of in situ rigs, including user-customized designs. You can add the optional in situ Interface Kit to your ZEISS Xradia XRM, which includes a mechanical integration kit, a robust cabling guide, and other facilities (feed-throughs) along with recipe-based software that simplifies your control from within the Versa Scout-and-Scan or ZEN navx user interfaces. When your needs require pushing the resolution limits of your in situ experiments, convert your ZEISS Xradia microCT or XRM to VersaXRM 730 X-ray microscope and leverage RaaD technology for the maximum performance tomographic imaging of samples within in situ chambers or rigs.
-
Begin Your Multi-Scale, Multi-Modal, Multi-Dimensional Microscopy with Non-destructive 3D Imaging
Because of the non-destructive nature of X-rays and the versatile array of sample types and sizes they are able to image, correlative microscopy often begins with, or is enabled by, ZEISS Versa XRM.
Using the Scout-and-Zoom or Volume Scout capabilities of Versa, you are able to clearly define your region of interest (ROI) before sacrificing your sample to premature cutting or other sample prep. Rapidly scout at low resolution with a large field of view, and then zoom to the ROI at higher resolution, whether using the range of Versa objectives (up to 40x-P), nanoscale ZEISS Ultra XRM, or ZEISS light, electron, or FIB-SEM microscopes. This prevents premature sample destruction and allows for maximum workflow efficiency while combining full sample context with key sample information.
Additionally, the ability to perform interior tomography, or to clearly see inside your sample in 3D, further reduces the risk of losing sight of your ROI. Achieve greater efficiency by pinpointing a specific “address” to which to navigate for accurate and efficient next steps for interrogating your sample.
Finally, examine your sample under varying conditions and over time with in situ and 4D studies before performing further analysis — chemical, surface, etc.— with other ZEISS modalities.
Leverage the widest array of microscopy solutions available — exclusively from ZEISS — to perform multi-modal, multi-lengthscale, multi-dimensional analyses, by starting with non-destructive 3D X-ray microscopy.
-
Investment Protection
Continuous improvement and upgradeability
As your imaging needs evolve, so should your instrument. The ZEISS Versa XRM family is built on the established ZEISS Versa 3D X-ray microscope platform that is upgradeable, expandable, and reliable, paving the way for future enhancements and protecting your investment. Select the system that is right for you today and expand as your needs require.
To make certain your system offers the latest capabilities and remains serviceable, you can field-convert your platform to the latest X-ray technology: your ZEISS Context microCT can become a CrystalCT® or higher performance Versa X-ray microscope. Your CrystalCT can become VersaXRM 730 with LabDCT. And every mid-tier Versa platform can be upgraded to the most advanced VersaXRM from ZEISS.
In addition to instrument conversions at your facility, new modules are continuously developed that will enhance your instrument to provide advanced capabilities such as in situ sample environments, unique imaging modalities, and productivity enhancing modules. Also, periodic major software releases include important new features that are made available to existing instruments, thereby enhancing and extending the capabilities of your research.
Discover the Advantages in Your Research Area
ZEISS VersaXRM - Microscopic Solutions for all Applications
-
Materials Research
- Experience the unique benefits of ZEISS VersaXRM, including non-destructive views of deeply buried microstructures, compositional contrast for studying challenging materials, and the ability to maintain RaaD for in situ imaging.
- Enjoy fast and intuitive 3D navigation technology for macro-scale inspection and easily identify regions of interest for high-resolution imaging.
- Benefit from faster throughput, improved image quality, and resolution performance, allowing for better data, increased sample statistics, more users, and enhanced instrument utilization.
Segmented active ingredient particles in an antihistamine tablet. Following imaging on a ZEISS Versa XRM, the data was reconstructed using ZEISS DeepRecon Pro to improve contrast between similar low density materials for better segmentation. Widest width of tablet is 5 mm.
3D rendering of a bund le of Rayon polymer fibers that have been imaged in propagation phase contrast mode. The 3D rendering shows a high-resolution 3D dataset processed using ZEISS PhaseEvolve to enhance the microvoids in individual fibers. Color represents void volume.
Tomography and segmentation of multiple phases in a high density concrete nuclear reactor vessel. 3D view shows segmentation of pores (red) and high-density minerals titanomagnetite and ilmenite (yellow) in chips of dolerite within the concrete. Concrete core 15 mm diameter. Sample courtesy of Giacomo Torelli, University of Sheffield, UK
Carbon fiber reinforced polymer composite.
-
Life Sciences
- Capture whole samples at multiple length scales with ZEISS VersaXRM, utilizing RaaD and FAST Mode to easily navigate and capture high-resolution regions of interest.
- Overcome limitations in imaging large sample volumes by leveraging ZEISS DeepScout, generating high-resolution overviews that were previously unreachable.
- Benefit from high-contrast images acquired with VersaXRM, enabling precise identification of structures of interest for fail-proof segmentation and localization for higher resolution acquisition using electron microscopy.
Dragonfly, imaged in its native structure without any sample preparation and sectioning.
Greyscale image is a single slice from a 3D dataset of a mouse brain that was imaged with the 40×-P objective of ZEISS Versa XRM and reconstructed using ZEISS DeepRecon Pro. Sample courtesy of Dr. Kevin Boergens, the University of Illinois at Chicago, US.
The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.
Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.
-
Geological Research
- Experience the fast and precise nanoscale tomography imaging capabilities of ZEISS VersaXRM for geological samples, enabling detailed examination of samples from Earth and beyond.
- Benefit from the accurate 3D nanoscale support for in situ studies, fluid flow analysis, mineral reactivity studies, mineral phase segmentation, and diffraction contrast tomography with ZEISS LabDCT Pro.
- Enjoy high throughput multiscale imaging and characterization of rock and fossil samples, leading to improved efficiencies and more time for data interpretation.
- Achieve higher quality data for enhanced image analysis and AI applications, and combine the power of ZEISS Versa XRM with automated segmentation software for CT automated quantitative mineralogy.
Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape, and distributions, as well as mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.
Quantitative XRM give a unique opportunity to identify key minerals in the battery raw materials supply chain. Spodumene and plagioclase feldspar can be clearly differentiated, and segmentation provides associated heavy mineral relationships.
Cu-Ni ore: 4-minute FAST Mode scan with DeepRecon Pro AI-assisted automated mineralogy with Mineralogic 3D provides particle analysis and mineral identification direct from XRM data for process mineralogy, liberation, and locking.
Segmentation of heavy minerals (orange) in a silicate-rich Vesta meteorite sample
-
Additive Manufacturing
- Utilize Scout-and-Zoom technology to swiftly access inner structures without any sample manipulation, saving time and effort.
- Enhance the speed of inspection throughout the additive manufacturing process chain, ensuring high-quality results.
- Benefit from class-leading submicron resolution to thoroughly analyze process parameters and material characteristics with precision.
Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.
Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.
Display lattice metal additive manufacturing manifold. Sample courtesy from Penn United Technologies Inc.
Additive manufactured lattice structure.
Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.
-
Electronics and Semiconductor Packaging
- Harness groundbreaking RaaD capability and AI-enabled fast scans to non-destructively image IC packages and internal defects.
- Simplify and optimize your experience with the intuitive ZEN navx user interface, which improves operational efficiency through built-in onscreen guidance, sample intelligence, and streamlined workflows.
- Achieve faster time-to-results with faster throughput at a large field of view (FOV), enabling quicker identification of failures, root causes, and facilitating more sample runs for failure analysis, packaging development, and competitive analysis applications.
Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.
2D slice view of solder fatigue cracks in a thermal cycled smartphone control board at 2.5 μm voxel resolution.
Non-destructive visualization and characterization of solder fatigue cracks in a thermal cycled smartphone control board at 2.5 μm voxel resolution.
3D visualization at 1 μm voxel resolution of the defective Cu pillar solder pins in a fingerprint sensor device.
-
Industrial Inspection and Quality Control
- Empower fast access to internal features of a part without the need for destruction or disassembly, thanks to Volume Scout technology embedded in ZEN navx.
- Achieve high-quality inspection of manufactured parts and assembled devices with faster throughput, while preserving their integrity.
- Conduct detailed analysis of microstructures in parts and evaluate their material characteristics with the class-leading submicron resolution.
Asthma inhaler, showing details of a drug particulates blockage at the exit of the actuator. 2D slice in the center was obtained from a full 3D scan of the device using FPX.
3D printed plastic lattice imaged in 17 seconds in FAST Mode on FPX.
Twisted iron honeycomb prepared by hydrogel infusion additive manufacturing (HIAM).
Number of DCT projections: 16652
Number of grains: > 100,000
Sample courtesy: Dr. Sammy Shaker, CalTech
X-ray microscopy scan of a small carburetor with a semi-transparent visualization of a 3D rendering showing its components, segmented in false colors, including porosity details segmented in red.
-
Lithium Ion Batteries
- Achieve high-resolution imaging of intact pouch and cylindrical cells for longitudinal studies of aging effects across hundreds of charge cycles with Resolution at a Distance.
- Benefit from the unmatched fidelity of the only tool capable of looking into an intact battery.
- Identify the region of interest for high-resolution investigations using Scout-and-Zoom.
- Enjoy dramatically reduced high-resolution scan times with VersaXRM.
- Conduct high-resolution interior tomographies across larger samples with ZEISS DeepScout.
Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.
Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.
Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x RaaD.
3D volume of materials within black mass, a powder generated from the crushing & shredding of recycled batteries. Cathode particles (blue) and residual foils (turquoise) individually segmented using Mineralogic 3D for quantification and analyses.
Accessories
Upgrade your microscope with additional accessories to enhance its capabilities
Flat Panel Extension (FPX)
Large Sample, High Throughput Scanning
FPX enhances imaging flexibility and creates workflow efficiencies for industrial and academic research. Scout-and-Zoom is a unique capability of ZEISS Versa X-ray microscopes that leverages FPX to perform a low resolution, large field of view, scout-scan to identify interior regions for higher resolution zoom-scans on a variety of different sample types. The Volume Scout workflow streamlines this process within ZEN navx. On ZEISS VersaXRM 730 and VersaXRM 615 platforms, FPX enables FAST Mode, allowing for sub-one-minute tomographies for efficient 3D navigation and rapid sample inspection. Combine with Volume Scout for end-to-end 3D navigation.
Autoloader
Maximize Your Instrument’s Utilization
Maximize use and minimize user intervention with the optional ZEISS Autoloader. Reduce the frequency of user interaction and increase productivity by enabling multiple jobs to run. Load up to 14 sample stations, which can support up to 70 samples, queue, and allow to run all day, or off-shift.
In Situ Interface Kit
Push the Limits of Scientific Discovery
ZEISS Versa platforms can accommodate a variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages, to user-customized designs. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.
ZEISS arivis Pro
ZEISS arivis Pro empowers you to automate image analysis and visualization pipelines. Leverage traditional methods or AI models effortlessly to create pipelines for any image size, dimension, or modality without the need to code.
ZEN AI Toolkit including Intellesis
Machine learning can exponentially increase the throughput of image analysis and reduce the risk of human error. This toolkit contains solutions for image denoising, image segmentation, and object classification.
3D World ZEISS edition
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy. Available exclusively through ZEISS, 3D World ZEISS edition an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. 3D World allows for navigation, annotation, creator files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.