Press Release

ZEISS invests in Taiwan with the opening of the new Hsinchu Innovation Center

Enhancing semiconductor R&D collaboration and leveraging local engineering talent in Taiwan

25 June 2024

Hsinchu, Taiwan | 25 June 2024 | ZEISS Group

ZEISS announced the opening of its new Innovation Center in Hsinchu Science Park, Taiwan, last week. The new ZEISS Innovation Center offers a comprehensive portfolio to meet the productivity needs of semiconductor research & development (R&D), production and failure analysis (FA) in Taiwan.

Upon opening, in phase one, the innovation center will feature light microscopes (LM), electron microscopes (EM), 3D X-ray microscopes (XRM), software solutions with artificial intelligence (AI) and other exclusive technologies for R&D and custom advanced workflows for FA from wafer to package. Additionally, the photomask solution business is part of the center as well with its established services and solutions for semiconductor customers.

Opening ceremony of the ZEISS Innovation Center in Hsinchu, Taiwan; from left to right: Peng Tat Cheong, Head of ZEISS Taiwan, Mr. Emile MP. Chang, Director General of Ministry of Economic Affairs, Maximilian Foerst, Head of ZEISS Greater China, Dr. Burn Lin, Dean of College of Semiconductor Research, National Tsing Hua University, Dr. Jochen Peter, Executive Board Member, ZEISS Group, Dr. Jun He, VP of Quality & Reliability(QR) / Advanced Packaging Technology / Service (APTS), TSMC, Dr. Michael Albiez, Head of ZEISS Research Microscopy Solutions, Dr. Wayne Wang, Director General of Hsinchu Science Park Bureau, Johnny Fan, Head of Semiconductor Mask Solution Taiwan, Henry Cai, Head of Research Microscopy Solutions Taiwan

Leveraging growth opportunities in the Asia-Pacific semiconductor and electronics industries

Peng Tat Cheong, Head of ZEISS Taiwan, said, “ZEISS Group invests more than 15 percent of its revenue in R&D annually. In recent years, we have seen the grand potential of Taiwan's semiconductor industry and formulated the ‘Taiwan to Global’ strategy.” Cheong added, “Through establishing this new innovation center we will initiate collaboration between the semiconductor and electronics industries in the Asia-Pacific region, and work with research institutions and academic departments to build talent, R&D and application centers. We will promote Taiwan’s semiconductor technology and talents to the Asia-Pacific, German, and international markets.”

ZEISS has nearly tripled the number of employees in Taiwan in the past five years, from 121 to 406 people, and has added, on average, one new direct-operated business unit each year. This makes Taiwan the fifth ZEISS location in the world with a complete set of five major ZEISS segments.

Unleashing the power of AI in next-generation failure analysis

ZEISS leverages a deep understanding of X-ray physics, lithography and customer applications to solve some of the most difficult imaging challenges in new and innovative ways. Its unique Advanced Reconstruction Toolbox (ART) leverages AI to obtain and increase the throughput of large field-of-view scans. It conducts a high-resolution scan to train the algorithm model to improve the reconstruction.

“ZEISS is known for its extraordinary technology of high-precision, efficient, and reliable solutions, and we are looking forward to joint development with customers in Taiwan through the ZEISS Hsinchu Innovation Center,” said Cheong.

Press contact Jörg Nitschke

Head of Corporate Brand, Communications and Public Affairs
ZEISS Group

About ZEISS

ZEISS is an internationally leading technology enterprise operating in the fields of optics and optoelectronics. In the previous fiscal year, the ZEISS Group generated annual revenue totaling 10 billion euros in its four segments Semiconductor Manufacturing Technology, Industrial Quality & Research, Medical Technology and Consumer Markets (status: 30 September 2023).

For its customers, ZEISS develops, produces and distributes highly innovative solutions for industrial metrology and quality assurance, microscopy solutions for the life sciences and materials research, and medical technology solutions for diagnostics and treatment in ophthalmology and microsurgery. The name ZEISS is also synonymous with the world's leading lithography optics, which are used by the chip industry to manufacture semiconductor components. There is global demand for trendsetting ZEISS brand products such as eyeglass lenses, camera lenses and binoculars.

With a portfolio aligned with future growth areas like digitalization, healthcare and Smart Production and a strong brand, ZEISS is shaping the future of technology and constantly advancing the world of optics and related fields with its solutions. The company's significant, sustainable investments in research and development lay the foundation for the success and continued expansion of ZEISS' technology and market leadership. ZEISS invests 15 percent of its revenue in research and development – this high level of expenditure has a long tradition at ZEISS and is also an investment in the future.

With over 44,000 employees, ZEISS is active globally in around 50 countries with more than 60 sales and service locations, 35 research and development facilities, and 35 production facilities worldwide (status: 31 March 2024). Founded in 1846 in Jena, the company is headquartered in Oberkochen, Germany. The Carl Zeiss Foundation, one of the largest foundations in Germany committed to the promotion of science, is the sole owner of the holding company, Carl Zeiss AG.

Further information at www.zeiss.com

Press Photos

Opening ceremony of the ZEISS Innovation Center in Hsinchu, Taiwan

Opening ceremony of the ZEISS Innovation Center in Hsinchu, Taiwan; from left to right: Peng Tat Cheong, Head of ZEISS Taiwan, Mr. Emile MP. Chang, Director General of Ministry of Economic Affairs, Maximilian Foerst, Head of ZEISS Greater China, Dr. Burn Lin, Dean of College of Semiconductor Research, National Tsing Hua University, Dr. Jochen Peter, Executive Board Member, ZEISS Group, Dr. Jun He, VP of Quality & Reliability(QR) / Advanced Packaging Technology / Service (APTS), TSMC, Dr. Michael Albiez, Head of ZEISS Research Microscopy Solutions, Dr. Wayne Wang, Director General of Hsinchu Science Park Bureau, Johnny Fan, Head of Semiconductor Mask Solution Taiwan, Henry Cai, Head of Research Microscopy Solutions Taiwan

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