Advanced Packaging and 3D Heterogeneous Integration

ZEISS solutions achieve significant advancements for package failure analysis workflows. By providing superior imaging and cross-sectional analysis, as well as a correlated workflow using artificial intelligence (AI), ZEISS delivers new insights from macroscale to nanoscale with fast time to results.

ZEISS microscopy solutions include:

• A unique portfolio of non-destructive 3D X-ray imaging tools that provides exceptional imaging and contrast at submicron resolutions, producing 3D datasets that can be viewed from any orientation using interactive virtual cross sections
• Optional AI reconstruction technologies, which enable up to 4X faster 3D X-ray scans while preserving high image quality
• A FIB-SEM with integrated femtosecond-laser providing a site-specific solution for rapid access to deeply buried features with superior imaging contrast and faster speeds than a Xenon plasma FIB
• Correlated workflows, which streamline time to results by connecting instruments to quickly navigate between multiple length scales and imaging modalities
  

Novel package technologies are extending Moore’s Law.  This enables timely introduction of new processes and faster yield optimization.  Our suite of microscopy instruments enables 2D and 3D package analysis at high resolution and high throughput for package development and failure analysis.