![Analog Microchips and Packages Analog Microchips and Packages]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/analog-rf-power-mems-sensors-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.240,0,1680,1440.file/analog-rf-power-mems-sensors-microscopy-solutions.jpg"})
Advanced Analysis for Complex New Materials and Structures
Faster Time to Market with Accurate Failure Analysis
The mobile communication, Internet of Things (IoT), cloud computing, and the electrification of automotive industries are driving huge demand for high-performing “More than Moore” semiconductor devices, which require the integration of new materials and processes, or novel silicon architectures and packaging technologies such as micro-electromechanical systems (MEMS). Direct band gap and wide band gap materials such as gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) present new challenges to equipment manufacturers and device fabricators alike. Many of these devices also integrate traditional ICs, which creates fabrication and packaging challenges.
To shorten the development cycle and speed time to market on these sophisticated devices, manufacturers need advanced analysis tools that can support complex new materials integration and root-cause analysis of failures.
![IGBT Cross Section and EDX Map IGBT Cross Section and EDX Map]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.100.100.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.360.360.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.768.768.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1024.1024.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1280.1280.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1440.1440.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1920.1920.0,0,1920,1920.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg"})
Cross Section and EDX of IGBT Device
![IGBT Cross Section and EDX Map IGBT Cross Section and EDX Map]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.100.100.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.360.360.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.768.768.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1024.1023.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1280.1279.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original.image_file.1440.1439.file/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg/_jcr_content/renditions/original./insulated-gate-bipolar-transistor-cross-section-and-edx-map-fib-sem.jpg"})
Cross Section and EDX of IGBT Device
Examination of the edge of a gate in an Insulated Gate Bipolar Transistor (IGBT) device. Cross section and EDX elemental analysis performed entirely on a ZEISS Crossbeam 550 FIB-SEM. Brightfield 30 kV STEM-in-SEM image of lamella combined with EDX elemental mapping in Crossbeam revealed crystalline Si precipitates.
![SiC MOSFET Dopant Profile SiC MOSFET Dopant Profile]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.100.75.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.360.270.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.768.576.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1024.768.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1280.960.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1440.1080.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1917.1438.0,0,1917,1439.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg"})
Dopant Profile Image of SiC MOSFET
![SiC MOSFET Dopant Profile SiC MOSFET Dopant Profile]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.100.75.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.360.270.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.768.576.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1024.768.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1280.960.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original.image_file.1440.1080.file/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg/_jcr_content/renditions/original./silicon-carbide-mosfet-dopant-profiling-fib-sem.jpg"})
Dopant Profile Image of SiC MOSFET
Cleaved SiC MOSFET device imaged at 1.5 kV in a ZEISS Crossbeam FIB-SEM. The image strongly highlights different implant doping regions due to the difference in work functions. The N+ diffusion is shown as a dark band underneath and extending to either side of the gate. The P-type body region is highlighted as a bright zone. This technique gives feedback on junction health and placement.
Nanoscale 3D X-ray Imaging of Smartphone Mainboard
![3D Image of Accelerometer - MEMS 3D Image of Accelerometer - MEMS]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-3d-xrm.jpg"})
3D Analysis of Smartphone Gyroscope / Accelerometer
![3D Image of Accelerometer - MEMS 3D Image of Accelerometer - MEMS]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-3d-xrm.jpg"})
3D Analysis of Smartphone Gyroscope / Accelerometer
3D X-ray reconstruction of silicon microcomb structures imaged at 1 µm/voxel resolution.
Acquired by ZEISS Xradia Versa X-ray microscope
![Plan View of Accelerometer MEMS Fine Comb Fins Plan View of Accelerometer MEMS Fine Comb Fins]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg"})
High-resolution Image Fine Comb Fin
![Plan View of Accelerometer MEMS Fine Comb Fins Plan View of Accelerometer MEMS Fine Comb Fins]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-plan-view.jpg"})
High-resolution Image Fine Comb Fin
Virtual plan view of same analysis showing fine comb fins imaged at 0.3 µm/voxel resolution.
Acquired by ZEISS Xradia Versa X-ray microscope
![Accelerometer MEMS Fine Comb Fins Cross Section Accelerometer MEMS Fine Comb Fins Cross Section]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg"})
Virtual Slice of Fine Comb Fins
![Accelerometer MEMS Fine Comb Fins Cross Section Accelerometer MEMS Fine Comb Fins Cross Section]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg/_jcr_content/renditions/original./smartphone-gyroscope-mems-fine-comb-fins-3d-xrm-cross-section.jpg"})
Virtual Slice of Fine Comb Fins
Virtual cross section of same sample showing a detailed view 2.1 µm fine comb fins imaged at 0.3 µm/voxel resolution.
Acquired by ZEISS Xradia Versa X-ray microscope
Non-destructive Analysis from System to Package to Interconnect
![3D X-ray Image of Smartphone 3D X-ray Image of Smartphone]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.100.100.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.360.360.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.768.768.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1024.1024.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1280.1280.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1440.1440.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1440.1440.240,0,1680,1440.file/smartphone-3d-xrm-image.jpg"})
Smartphone
![3D X-ray Image of Smartphone 3D X-ray Image of Smartphone]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.100.75.file/smartphone-3d-xrm-image.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.360.270.file/smartphone-3d-xrm-image.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.768.576.file/smartphone-3d-xrm-image.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1024.768.file/smartphone-3d-xrm-image.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1280.960.file/smartphone-3d-xrm-image.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original.image_file.1440.1080.file/smartphone-3d-xrm-image.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-3d-xrm-image.jpg/_jcr_content/renditions/original./smartphone-3d-xrm-image.jpg"})
Smartphone
3D X-ray image of an entire smartphone image at 50 µm/voxel resolution.
Acquired by ZEISS Xradia Context microCT
![PMIC Package Virtual Plan View PMIC Package Virtual Plan View]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.100.100.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.360.360.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.768.768.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1024.1024.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1280.1280.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1439.1439.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1439.1439.482,0,1921,1439.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg"})
Power Management IC Package
![PMIC Package Virtual Plan View PMIC Package Virtual Plan View]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.100.75.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.360.270.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.768.576.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1024.768.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1280.960.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original.image_file.1440.1080.file/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-package-3d-xrm-plan-view.jpg/_jcr_content/renditions/original./smartphone-power-management-ic-package-3d-xrm-plan-view.jpg"})
Power Management IC Package
Virtual plan view of power management integrated circuit (PMIC) package imaged at 11 µm/voxel resolution.
Acquired by ZEISS Xradia Context microCT
![PMIC Package Interconnects Cross Section PMIC Package Interconnects Cross Section]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1439.1439.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1439.1439.482,0,1921,1439.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg"})
PMIC Interconnects
![PMIC Package Interconnects Cross Section PMIC Package Interconnects Cross Section]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.75.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.270.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.576.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.768.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.960.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1080.file/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg/_jcr_content/renditions/original./smartphone-power-management-ic-interconnects-3d-xrm-cross-section.jpg"})
PMIC Interconnects Cross Section
Virtual cross section of PMIC solder bumps and vias imaged at 2.1 µm/voxel.
Acquired using the unique Resolution at a Distance capability of ZEISS Xradia Versa X-ray microscope
Analog Chip Imaged with EBAC
A digital counting chip examined with nanoprobing in a GeminiSEM at 20 kV. The Electron Beam Absorbed Current (EBAC) image contains information about the interconnectivity of sub-surface wiring and the buried p/n junctions.