Revolutionizing Semiconductor Failure Analysis

The semiconductor industry has increasingly focused on advanced packaging innovations to improve device performance and reliability. However, the adoption of the emerging package architectures, materials and components has challenged the existing fault isolation and failure analysis techniques. Through continuous innovations in hardware and software, ZEISS Versa 3D X-ray microscope (XRM) family delivers the best non-destructive imaging solution with its unique Resolution-at-a-Distance technology and the new intuitive and productive ZEN navxTM user interface. Correlated with ZEISS Crossbeam laser FIB-SEM, the proven XRM-laserFIB workflow accelerates packaging development and failure analysis.

In this webinar section, we present how the latest solutions with focus on XRM and laser crossbeam will enable you to solve key challenges in fault isolation and physical failure analysis. We demonstrate the efficacy and efficiency of ZEISS failure analysis workflows applied to next-generation electronics packages, such as fan-out wafer-level package (FOWLP), heterogenous integration, and hybrid bonds.