In Situ Lab for ZEISS FE-SEM
Your Integrated Solution for Multi-modal in situ Experiments
When you need to link materials performance to microstructure, ZEISS puts an automated in situ heating and tension experimental lab at your disposal. Observe materials under heat and tension automatically while plotting stress-strain curves on the fly.
Extend your ZEISS FE-SEM with an in situ solution for heating and tensile experiments. Investigate materials like metals, alloys, polymers, plastics, composites, and ceramics.
Fast Setup, One Workstation.
Combine a mechanical tensile or compression stage, a heating unit, dedicated high-temperature SE and BSE detectors with EDS (energy dispersive spectroscopy) or EBSD (electron backscattered diffraction) analytics from our exclusive integrated in situ analytics provider, Oxford Instruments.
Thanks to the design of ZEISS Gemini electron optics, integration of in situ hardware is very straightforward. Control all system components from a single PC with a unified software environment that enables unattended, automated materials testing for your tensile and heating experiments.
Automatic Feature Tracking and Autofocus.
The automatic feature tracking provides you with a new standard for automatic series imaging and analytics such as EDS or EBSD mapping. Start your in situ experiment with defining multiple regions of interest (ROIs), center them automatically, perform autofocus and use different imaging magnifications, scan rates or detectors.
Subsequently, investigate each ROI at each deformation step during the automatic workflow. Different imaging conditions such as scan methods, dwell time and image resolution can be chosen individually for each ROI. Trigger EDS and EBSD maps for selected ROIs as a function of applied tension at a set temperature.
Reliable Post-Processing.
Obtain information on local strain distribution with micrometer resolution of your ROI. Acquire a series of SEM images and benefit from automatic feature tracking taking place during deformation and eventually use it for DIC. Export your resulting images to the 2D DIC GOM Correlate software to analyze strain distribution and overlay with your SEM images.
Combining imaging and analytics enables you to characterize mechanical properties influenced by a combination of the following inclusion parameters: shape, size, quantity, interspacing, distribution, orientation and interfacial strength.