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Perfect Tomographies. Every Sample. Every User. Every Time.

Introducing ZEISS VersaXRM 730

ZEISS presents our newest VersaXRM® 730 3D X-ray microscope (XRM) which offers a wider array of choices than any advanced XRM on the market.

New opportunities in a constantly shifting technology landscape require new capabilities. And dynamic workforce requirements demand  an intuitive user environment.

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Introducing ZEISS VersaXRM 730

Discover limitless potential with the exclusive 40x-Prime objective and award-winning ZEN navx.

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Discover the Updates

Whats New on ZEISS VersaXRM 730
Breakthrough Resolution Performance

40x-Prime Objective
500 nm spatial resolution from 30kV – 160 kV

Resolution Performance at a Distance:
700 nm @ 50 nm
750 nm @100 mm
 
ZEN navx User Interface

The ZEN navx guidance and control system enables users of every skill level to quickly achieve great results. Benefit from human-centered mental models and parameter guidance to optimize workflows, ensure efficiency and productivity.
DeepRecon Pro + Workstation

VersaXRM 730 now includes the high performance ART workstation and a 2-year license for DeepRecon Pro, the premier image reconstruction software that takes your imaging from good to great, with better image quality or faster throughput.
FAST Mode enabled by FPX

Introducing FAST Mode for one-minute tomographies, enabled for the Flat Panel Extension (FPX). Your sample rotates continuously while X-ray transmission images are acquired at different angles, eliminating the overhead time of “step-and-shoot” acquisition for dramatically faster scan times. FAST Mode combines with Volume Scout (via ZEN navx) for end-to-end 3D navigation.

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Application Examples

ZEISS VersaXRM 730 at work

Discover the Advantages in Your Research Area

ZEISS VersaXRM 730 - Microscopic Solutions for all Applications
  • RaaD bietet viele Vorteile

    Flux grown layered KBiS2 semiconductor crystal. 3D volume rendering shows the complex 3D microstructure consisting of rod and needle structure. Sample courtesy of Prof. Daniel Shoemaker, UIUC

    Materials Research

    • Experience the unique benefits of ZEISS VersaXRM 730, including non-destructive views of deeply buried microstructures, compositional contrast for studying challenging materials, and the ability to maintain RaaD for in situ imaging. 
    • Enjoy fast and intuitive 3D navigation technology for macro-scale inspection and easily identify regions of interest for high-resolution imaging. 
    • Benefit from faster throughput, improved image quality, and resolution performance, allowing for better data, increased sample statistics, more users, and enhanced instrument utilization.

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    Life Sciences

    • Capture whole samples at multiple length scales with ZEISS VersaXRM 730, utilizing RaaD and FAST Mode to easily navigate and capture high-resolution regions of interest.
    • Overcome limitations in imaging large sample volumes by leveraging ZEISS DeepScout, generating high-resolution overviews that were previously unreachable.
    • Benefit from high-contrast images acquired with VersaXRM 730, enabling precise identification of structures of interest for fail-proof segmentation and localization for higher resolution acquisition using electron microscopy.
  • Zuglastversuch von lasergeschweißtem Stahl unter steigender Belastung.

    Quantitative XRM give a unique opportunity to identify key minerals in the battery raw materials supply chain. Spodumene and plagioclase feldspar can be clearly differentiated, and segmentation provides associated heavy mineral relationships.

    Geological Research

    • Experience the fast and precise nanoscale tomography imaging capabilities of ZEISS VersaXRM 730 for geological samples, enabling detailed examination of samples from Earth and beyond.
    • Benefit from the accurate 3D nanoscale support for in situ studies, fluid flow analysis, mineral reactivity studies, mineral phase segmentation, and diffraction contrast tomography with ZEISS LabDCT Pro.
    • Enjoy high throughput multiscale imaging and characterization of rock and fossil samples, leading to improved efficiencies and more time for data interpretation.
    • Achieve higher quality data for enhanced image analysis and AI applications, and combine the power of ZEISS Versa XRM with automated segmentation software for CT automated quantitative mineralogy.

  • 3D rendering of an add itively manufactured Inconel lattice structure at multiple scales. Full 5 mm sample is imaged at 5 µm/voxel and then targeted defect zone imaged at 140 kV with 40x-P detector at 0.4 µ m/voxel and reconstructed with ZEISS DeepRecon Pro. Cracks and voids are visible in the high r esolution image that are not visible at lower r esolutions.

    Additive Manufacturing

    • Utilize Scout-and-Zoom technology to swiftly access inner structures without any sample manipulation, saving time and effort.
    • Enhance the speed of inspection throughout the additive manufacturing process chain, ensuring high-quality results.
    • Benefit from class-leading submicron resolution to thoroughly analyze process parameters and material characteristics with precision.

  • 3D view of a radio frequency package acquired at 1.2 µm voxel resolution with FAST Mode acquisition for 10 min scan.

    Electronics and Semiconductor Packaging

    • Harness groundbreaking RaaD capability and AI-enabled fast scans to non-destructively image IC packages and internal defects.
    • Simplify and optimize your experience with the intuitive ZEN navx user interface, which improves operational efficiency through built-in onscreen guidance, sample intelligence, and streamlined workflows.
    • Achieve faster time-to-results with faster throughput at a large field of view (FOV), enabling quicker identification of failures, root causes, and facilitating more sample runs for failure analysis, packaging development, and competitive analysis applications.

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    X-ray microscopy scan of a medical device, a dry powder inhaler. A cross-sectional virtual slice of a scan obtained using FPX is shown on the left and a clipped 3D rendering on the right. Different grayscale values on the left side c orrespond to different density materials.

    Industrial Inspection and Quality Control

    • Empower fast access to internal features of a part without the need for destruction or disassembly, thanks to Volume Scout technology embedded in ZEN navx.
    • Achieve high-quality inspection of manufactured parts and assembled devices with faster throughput, while preserving their integrity.
    • Conduct detailed analysis of microstructures in parts and evaluate their material characteristics with the class-leading submicron resolution.

  • 3D renderings and 2D slice view of rechargeable lithium ion 2025 coin cell battery.

    Lithium Ion Batteries

    • Achieve high-resolution imaging of intact pouch and cylindrical cells for longitudinal studies of aging effects across hundreds of charge cycles with Resolution at a Distance.
    • Benefit from the unmatched fidelity of the only tool capable of looking into an intact battery.
    • Identify the region of interest for high-resolution investigations using Scout-and-Zoom.
    • Enjoy dramatically reduced high-resolution scan times with VersaXRM 730.
    • Conduct high-resolution interior tomographies across larger samples with ZEISS DeepScout.