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ZEISS@Semicon Europa
Comprehensive Portfolio and Intelligent Workflows
Microscopy Systems
FIB-SEM tomography of a 3D NAND sample acquired using ZEISS Crossbeam 550 and Atlas-3D. Sample was depackaged and mechanically polished down to the topmost word line. Shown is a virtual sub-volume of 2 x 1.5 x 0.7 µm3 size, extracted from the dataset at the transition region of upper to lower deck. Reconstructed voxel size 4 x 4 x 4 nm3.
The resulting reconstruction allows for looking at multiple planes of section across the device from any virtual section.
Virtual Reality
Immerse yourself to explore uncharted territories
Visit us and join ZEISS Virtual Reality Experience! Discover Resolution at a Distance with Non-destructive 3D X-ray Imaging and dive into the 3D world of the new ZEISS Xradia 620 Versa with Dual Scan Contrast Visualizer. Xradia 620 Versa unlocks new degrees of versatility for your research and achieves faster time to results for varied sample sizes without compromising resolution. Let Virtual Reality transport you into the heart of the action of ZEISS Crossbeam with combined imaging and analytical performance of a high-resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). Immerse Yourself to explore uncharted territories and step into our Virtual Reality Experience at Semicon 2023!
Semiconductor Industry
Individual software solutions
With our software engineering, we optimise and modernise infrastructures and environmental architectures in the cleanroom. We connect entire production chains, eliminate ineffective isolated solutions and anchor the possibility for cross-location platform architectures on a cloud basis. You benefit from higher quality, production reliability and more efficient use of resources.