ZEISS Crossbeam 550

Crossbeam 550 Samplefab user interface has been completely redesigned to facilitate rapid learning and intuitive operation for both novices and expert users, ensuring a seamless experience. The enhanced control software improves stability and usability, further streamlining the operational process.

Crossbeam 550 Samplefab microscope’s hands-free TEM lamella preparation process can create 10 lamellae in under 8 hours, saving valuable time and resources. Its proprietary lift-out technology provides superior automation yield and the ability to thin down to 100 nm on a variety of semiconductor sample types, ensuring high-quality results every time.

Recipe-based automation promises an automation yield of >90% for unsupervised processing of lamellae from bulk sample to TEM grid, without operator intervention. Automated checks allow human interventions to ensure no lamella are lost during processing, driving lamella success rates towards 100%.

The Crossbeam Samplefab workflow is so robust that dozens of lamellae can be created using a single probe tip, which only needs reshaping after multiple days of heavy use. This significantly enhances the tool's productive uptime and reduces expenses on consumables, ultimately saving you both time and money.