Product

ZEISS Crossbeam Samplefab

FIB-SEM to Simplify Automated TEM Sample Preparation

Achieve fully-automated and unattended TEM sample preparation in your semiconductor lab with ZEISS Crossbeam 550 Samplefab, a robust pre-configured high-end FIB-SEM. Obtain best sample quality and high automation reliability with high lamella success rates, especially for multi-site preparations. Enjoy an intuitive user interface designed for fast learning and optimum efficiency without sacrificing flexibility.

Unlock the potential of your lab productivity
Achieve reliable and precise endpointing
Benefit from an automation yield promise of >90% for unsupervised lamella processing from bulk sample to TEM grid

  
      Simplify Your TEM Lamella Sample Preparation
      
    and Experience Industry-leading Automation Yield

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Full FIB automation of TEM sample preparation - from bulk milling to lift-out and thinning - is delivered through a segmented workflow that can be linked as desired for in situ and ex situ lift-out workflows.

The user interface of the ZEISS Crossbeam 550 displayed

User-Friendly Interface

for Easy Operation

Crossbeam 550 Samplefab user interface has been completely redesigned to facilitate rapid learning and intuitive operation for both novices and expert users, ensuring a seamless experience. The enhanced control software improves stability and usability, further streamlining the operational process.

Automated TEM Sample Preparation

for Optimized Results

ZEISS Crossbeam 550 Samplefab microscope’s hands-free TEM lamella preparation process can create 10 lamellae in under 8 hours, saving valuable time and resources. Its proprietary lift-out technology provides superior automation yield and the ability to thin down to 100 nm on a variety of semiconductor sample types, ensuring high-quality results every time.

Grapic that shows statistics of a recent 100 lamellas experiment

Superior Automation Yield

for Maximum Success Rates

Recipe-based automation promises an automation yield of >90% for unsupervised processing of lamellae from bulk sample to TEM grid, without operator intervention. Automated checks allow human interventions to ensure no lamella are lost during processing, driving lamella success rates towards 100%.

Application image of the ZEISS Crossbeam 550 Samplefab FIB-SEM

Stable and Efficient Workflow

for Increased Productivity

The Crossbeam Samplefab workflow is so robust that dozens of lamellae can be created using a single probe tip, which only needs reshaping after multiple days of heavy use. This significantly enhances the tool's productive uptime and reduces expenses on consumables, ultimately saving you both time and money.

To address the growing industry need for TEM sample preparation, we have built a dedicated FIB-SEM, the Crossbeam 550 Samplefab. Our focus is to offer the most robust automation available on the market today, allowing fully unsupervised operation of down to 100 nm thin lamellae with high accuracy and throughput.

Dr. Thomas Rodgers Head of business sector electronics at ZEISS Microscopy

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ZEISS Crossbeam Samplefab

FIB-SEM to Simplify Automated TEM Sample Preparation

Simplify Your TEM Lamella Sample Preparation

and Experience Industry-leading Automation Yield