Webinar
Low-kV Scanning Electron Microscopy
Beyond Sample Topography
19 June 2020
· 44 min watch
![]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.100.100.16,38,773,795.file/iwona-jozwik.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.360.360.16,38,773,795.file/iwona-jozwik.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.757.757.16,38,773,795.file/iwona-jozwik.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.757.757.16,38,773,795.file/iwona-jozwik.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.757.757.16,38,773,795.file/iwona-jozwik.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.757.757.16,38,773,795.file/iwona-jozwik.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/authors/iwona-jozwik.png/_jcr_content/renditions/original.image_file.757.757.16,38,773,795.file/iwona-jozwik.png"})
Author
Iwona Jóźwik, Ph.D.
Łukasiewicz Institute of Electronic Materials Technology
Abstract
FIB-SEM allow to obtain morphological, compositional and analytical information from the surface, and cut cross-sections to image beneath the sample surface at the highest resolution. Moreover, this is the perfect tools to prepare specimens for other microscopic techniques such as TEM or STEM.
![]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.100.56.0,5,1304,739.file/screensaver_low-kv-sem.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.360.203.0,5,1304,739.file/screensaver_low-kv-sem.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.768.432.0,5,1304,739.file/screensaver_low-kv-sem.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.1024.576.0,5,1304,739.file/screensaver_low-kv-sem.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.1280.720.0,5,1304,739.file/screensaver_low-kv-sem.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.1304.734.0,5,1304,739.file/screensaver_low-kv-sem.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/resource-center/insights-hub/thumbnails/screensaver_low-kv-sem.png/_jcr_content/renditions/original.image_file.1304.734.0,5,1304,739.file/screensaver_low-kv-sem.png"})
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