Advanced Packaging

Advanced packaging technologies have revolutionized semiconductor performance, enabling enhanced functionality and miniaturization beyond traditional transistor scaling. This article delves into the cutting-edge 3D heterogeneous integration, spotlighting through-silicon vias (TSVs) and chiplets that facilitate complex system-in-package (SiP) designs. With high-density interconnects and multi-die configurations, advanced packaging addresses the escalating demands for faster and more efficient electronics. We explore how ZEISS's non-destructive 3D X-ray microscopy plays a pivotal role in the characterization and failure analysis of these sophisticated technologies. The integration of artificial intelligence in imaging provides unprecedented insights into defect analysis, improving yield and reliability. The use of femtosecond laser in FIB-SEM enables rapid access to deeply buried features, enhancing the accuracy of defect identification and resolution. Through comprehensive analysis, the article illuminates how these technologies contribute to extending Moore's Law, facilitating faster process development and integration while optimizing yield in semiconductor manufacturing. This narrative not only highlights the technological advancements but also underscores the critical role of innovative microscopy techniques in maintaining the pace of advancements in the semiconductor industry.