Stop by booth #601 to learn about the latest advances in 3D X-ray microscopy, FE-SEM, and FIB-SEM solutions for failure analysis and process development.

ZEISS has an exciting array of presentations, papers, and new products to share at ISTFA. Learn about a new workflow for characterizing advanced package interconnects, including RDL and hybrid bonds. Attend tutorials on 3D X-ray microscopy, defect localization, SEM basics, and AI advancements for fault isolation and FA.

Sign up to attend a virtual demo of our newly launched VersaXRM® 730 3D X-ray microscope and hear about other exciting product news. Secure one of the limited slots.

Monday, October 28

Tutorial – AI-driven Advancements in Image Processing, Analysis and 3D Modeling for Fault Isolation and Failure Analysis
Session: Technology Specific and Featured Topics II – 10:20 am PST
Dr. Flavio Cognigni, Dr. Giulio Lamedica, Dr. Heiko Stegmann, ZEISS Microscopy; Dr. Domenico Mello, EM Microelectronic; Dr. Anton du Plessis, Comet Technologies; Prof. Marco Rossi, Sapienza University of Rome

Tutorial - Defect Localization Methods for Device Characterization and Yield Management
Session: Fault Isolation IV – 1:20 pm PST
Greg Johnson, ZEISS Microscopy
 

Tutorial - Basics and Current Aspects of Scanning Electron Microscopy
Session: Microscopy III – 2:20 pm PST
Heiko Stegmann, ZEISS Microscopy
 

Tutorial - Fundamentals and Emerging Capabilities of 3D X-ray Microscopy for Semiconductor Advanced Package Failure Analysis
Session: Package and Physical Analysis Challenges II – 2:20 pm PST
Cheryl Hartfield, ZEISS Microscopy

Tuesday, October 29

Integrating Multimodal Microscopy and Artificial Intelligence Solutions for Laser Dicing Process Induced Defect Identification
Session: Case Studies: FA Process and Workflows – 1:30 pm PST
Dr. Flavio Cognigni, Dr. Giulio Lamedica, Dr. Heiko Stegmann, ZEISS Microscopy; Dr. Domenico Mello, Dr. Guillaume Fiannaca, Dr. Philippe Von Gunten, EM Microelectronic; Dr. Anton du Plessis, Comet Technologies; Prof. Marco Rossi, Sapienza University of Rome

Top-down Junction Analysis in SiC MOSFET
Session: Power Devices (Si, SiC, GaN) – 2:30 pm PST
Greg Johnson, ZEISS Microscopy; Dr. Pietro Paolo Barbarino, Giuseppe Sciuto, Massimiliano Astuto, Giancarlo Calvagno, Dr. Roberta Ricciari, STMicroelectronics; Andreas Rummel, Kleindiek Nanotechnik

Wednesday, October 30

A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages
Session: Package Level Fault Isolation – 11:00 am PST
Dr. Allen Gu, ZEISS Microscopy

AFM-in-SEM for Precise Endpoint Delayering
Session: Scanning Probe Analysis – 3:00 pm PST
Greg Johnson, ZEISS Microscopy; Dr. Frank Hitzel, DoubleFox

Thursday, October 31

Few-shot AI Segmentation of Semiconductor Device FIB-SEM Tomography Data
Session: AI Applications for Failure Analysis Session – 9:00 am PST
Dr. Heiko Stegmann, Dr. Flavio Cognigni, ZEISS Microscopy

Friday, November 1

Consideration of a Ga-FIB in Lamella Sample Prep for EBIC/EBAC Analysis of Advanced-node SRAMs
Session: Nanoprobing, Electrical Characterization I – 9:20 am PST
Greg Johnson, Dr. Heiko Stegmann, Cheryl Hartfield, ZEISS Microscopy; Andreas Rummel, Dr. Lorenz Lechner, Kleindiek