Effective and Repeatable End-Pointing During TEM Lamella Prep

Producing high-quality lamella for TEM or STEM-in-SEM imaging requires thinning to a specific thickness, with minimal damage and, at times, at specific target areas. The Crossbeam FIB-SEM platform provides unique capabilities for any user to create such high-quality lamellae. In this workshop, the workflow of thinning lamellae will be covered: the use of live imaging while milling at any e-beam and I-beam conditions to monitor lamella thickness, the use of live imaging while milling to monitor polishing orientation and location, and other tips and tricks for lamella thinning/end-pointing.

This virtual workshop consisting of one three-hour session, streamed live from the ZEISS Microscopy Customer Center (ZMCC) in Dublin, CA. Through screen-sharing from the instrument and multiple cameras, the complete operation of the instrument will be visible as our SEM Application experts cover a full itinerary of training topics as detailed below.

It is recommended that attendees secure time on their instruments after the workshop sessions to apply the shared methods on their own samples. Attendees are strongly encouraged to share their images from individual sessions and interact with our Applications team through independent email threads for further optimization.

Who should attend?

• Existing users of ZEISS Crossbeams interested in thinning lamellae generally or to target specific features
• Existing users of Crossbeam looking to improve their current skill level to better support and/or train other users​
  
  

Learning objectives after completion of this workshop, attendees should:

• Benefit from reproducible lamella thinning by leveraging built-in and optional features on the Crossbeam
• Have the confidence to always produce results on precious samples containing important, unique features by using tips and tricks covered in the targeted lamella preparation and thinning
• Learn the best practices for using the range of high and low-kV FIB probes to minimize amorphous damage on lamella

This is a paid workshop.​
Spots are limited.​

Access to a FIB-SEM after each day is strongly recommended to apply lessons learned and share results with applications team for further support.