![半导体和电子元件 半导体和电子元件]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original.image_file.100.100.file/advanced-semiconductor-packaging.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original.image_file.360.360.file/advanced-semiconductor-packaging.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original.image_file.768.768.file/advanced-semiconductor-packaging.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/advanced-semiconductor-packaging.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original./advanced-semiconductor-packaging.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original./advanced-semiconductor-packaging.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/advanced-semiconductor-packaging.jpg/_jcr_content/renditions/original./advanced-semiconductor-packaging.jpg"})
显微镜解决方案
半导体和电子元件
全面产品组合和智能工作流
在现代经济中,数字技术无处不在。消费者互连器件性能和可靠性的提高推动了对更高效、小巧的半导体的需求增长。多个行业和消费市场对高性能、无缺陷芯片的需求又加速了产品开发进程,以供应范围广泛的半导体和电子产品。制造商必须加快速度,缩短高度复杂器件从设计到生产的周期。为此,需要利用先进的显微镜解决方案和软件的智能工作流来快速解决严重影响制造产量和设备性能的问题。
在现代经济中,数字技术无处不在。消费者互连器件性能和可靠性的提高推动了对更高效、小巧的半导体的需求增长。多个行业和消费市场对高性能、无缺陷芯片的需求又加速了产品开发进程,以供应范围广泛的半导体和电子产品。制造商必须加快速度,缩短高度复杂器件从设计到生产的周期。为此,需要利用先进的显微镜解决方案和软件的智能工作流来快速解决严重影响制造产量和设备性能的问题。