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Making complex structures intelligently visible Future-proof microchip development
Unique in the world
The scalpel for complex semiconductor structures
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The 3D Metrology and Inspection Workstation from ZEISS
The 3D Metrology and Inspection Workstation allows the volume of microchips to be sampled, analyzed and validated with nanometer accuracy using FIB tomography. ZEISS relies on a high-resolution 3D imaging process in combination with an intelligent analysis platform.
Product Highlights
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FIB-SEM combination
Randomly exposed wafers are removed from chip production. The Focused Ion Beam (FIB) microscope is the heart – the "scalpel" – of the 3D Metrology and Inspection Workstation. This focused ion beam cuts out random samples at various points on the wafer, whose three-dimensional nanostructures are then precisely examined using a scanning electron microscope (FIB-SEM).
High resolution 3D display
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Overcoming complex process challenges
The highest slicing sharpness in its class for a maximum voxel count (3D resolution). With fully automated volume acquisition, in an extremely wide-angle field of view, and intuitive workflow, the workstation provides valuable insights for metrology and defect detection in the manufacturing of 3D memory chips.